Flexible Circuit Board Printing Service 12 Floors FR-4 DDR4 GALAXY Fury CORSAIR

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SMT PCB Service [38]
Large PCB Prototype Board [22]
HDI Printed Circuit Boards [25]
Ultra Thin PCB [19]
Multilayer Printed Circuit Board [27]
PCB Printing Service [24]
FR4 Printed Circuit Board [21]
High Frequency PCB [16]
Metal Substrate PCB [15]
Copper Substrate PCB [13]
IC Circuit Board [4]
IC Package Substrate [4]

Shenzhen Chaosheng Electronic Technology Co.,Ltd

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Flexible Circuit Board Printing Service 12 Floors FR-4 DDR4 GALAXY Fury CORSAIR

Name: Flexible Circuit Board Printing Service 12 Floors FR4 DDR4 GALAXY Fury CORSAIR
Brand: Shenzhen, Guangdong, China
Price: 1.5 USD

China Flexible Circuit Board Printing Service 12 Floors FR-4 DDR4 GALAXY Fury CORSAIR wholesale

Brand Name : Shenzhen, Guangdong, China

Model Number : China chao sheng

Certification : ISO/UL/RoHS/TS

Place of Origin : cspcb1708

MOQ : 1PCS

Price : usd1.5-3.5/pcs

Payment Terms : T/T, Western Union, MoneyGram

Supply Ability : 20-200K/pcs per month

Delivery Time : 15-20day

Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box

Product Area : Various Desktops, Laptop Memory Modules

Material : 1.60mm,0.80mm

Minimum Hole : 0.10mm

Product Structure : 4-12layers Of 2nd Order HDI

Impedance Value : ±5%

Minimum Line Width And Space : 3/3mil

Surface Treatment : Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin

Provide PCB Information : Gberber, Production Requirements, MOQ Quantity

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4-12layers Various desktops, laptop memory modules floorsThick copper PCB FR-4,DDR4 GALAXY Fury CORSAIR printed circuit boar

PCB FR-4, TG170,2.50mm, inner layer 1OZ, outer layer 0.5OZ,prototype pcb,prototype pcb boardSmart drive products

12 floors, FR-4, TG150,

Plate thickness 1.60mm, inner layer 1OZ, outer layer 0.5OZ

Green solder mask + cover film, minimum line

width 8/8mil, minimum hole 0.10mm

Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB

standard.

Quantities range from prototype to volume production.

100% E-Test

Packaging: Vacuum Packaging + Moisture-proof Bead + Humidity Card + Carton

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Our Quality processes include

IQC: Incoming Quality Control (Incoming Materials Inspection)
First Article Inspection for every process
IPQC: In Process Quality Control
QC: 100% Test & Inspection
QA: Quality Assurance based on QC inspection again
Workmanship: IPC-A-610, ESD
Quality Management based on CQC, ISO9001:2008, ISO 14001:2004

PCB, FPC process production capability

Technical ltem		MassProduct	Advanced Technology
		2016	2017	2018
Max.Layer Count		26L	36L	80L
Through-hole plate		2～45L	2～60L	2～80L
Max.PCBSize(in)		24*52"	25*62"	25*78.75"
The layer number of FPC		1～36L	1～50L	1～60L
Max.PCBSize(in)		9.8"*196"	9.8"*196"	10"*196"Reel to reel
Layeredplatelayer		2～12L	2～18L	2～26L
Max.PCBSize(in)		9"*48"	9"*52"	9"*62"
Combination of hard and soft layers		3～26L	3～30L	3～50L
Interconnect HDI		5+X+5Interconnect HDI	7+X+7Interconnect HDI	8+X+8,Interconnect HDI
HDI PCB		4～45L	4～60L	4～80L
Interconnect HDI		3+20+3	4+X+4Interconnect HDI	4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"	24"*49"	25"*52"
Material		FR-4 Rogers	FR-4 Rogers	FR-4 Rogers
Base material		Halogenfree,LowDK	Halogenfree,LowDK	Halogenfree,LowDK
Build-up Material		FR-4	FR-4	FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43	0.42～8.0mm	0.38～10.0mm
	Min.16L(mm)	0.53	1.60～8.0mm	0.45～10.0mm
	Min.18L(mm)	0.63	2.0～8.0	0.51～10.0mm
	Min.52L(mm)	0.8	2.50～8.0mm	0.65～10.0mm
	MAX(mm)	3.5	10.0mm	10.0mm
Min.CoreThickness um(mil)		254"(10.0)	254"(10.0)	0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)	32(1.3)	25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ	4/1-15 OZ	4/1-0.30mm
	Out Layer	4/1-10 OZ	4/1-15 OZ	4/1-30 OZ
Gold thick		1～40u"	1～60u"	1～120u"
Nithick		76～127u"	76～200u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)

Min. IVH,Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes

viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes

Laser Hole Filling		Yes	Yes	Yes

Technicalltem			Mass Product	Advanced Technolgy
			2017year	2018year	2019year
Drill hole depth ratio		ThroughHole	2017year	.40:1	.40:1
Aspet Ratio		Micro Via	.35:1	1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)			10(0.4)	10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)			0.3	0.3	0.3
Min.PTH Hole ring um(mil)			75(3mil)	62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL	±0.50	±0.50	±0.50
		2.5Mil≤L/W∠4mil	±0.50	±0.50	±0.50
		≦3mil	±0.60	±0.60	±0.60
Laminated structure		Layer by layer	3+N+3	4+N+4	5+N+5
		Sequential Build-up	20L Any Layer	36L Any Layer	52L Any Layer
		Multi-layer overlay	N+N	N+N	N+N
			N+X+N	N+X+N	N+X+N
		sequential Lamination	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process			PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

PCB, FPC main material supply

NO	supplier	Supply material name	Material origin
1	Japan	High frequency materials, PI, covering membrane,Copper berth	Mitsubishi Japan
2	dupont	High frequency materials, PI, covering film, dry film,Copper berth	Japan
3	panasonic	High frequency materials, PI, covering membrane,Copper berth	Japan
4	SanTie	PI, covering membrane	Japan
5	Born good	FR-4,PI,PP,Copper berth	shenzhen, China
6	A rainbow	PI, covering membrane,Copper berth	Taiwan
7	teflon	High frequency materials	The United States
8	Rogers	High frequency materials	The United States
9	Nippon Steel	PI, covering membrane,Copper berth	Taiwan
10	sanyo	PI, covering membrane,Copper berth	Japan
11	South Asia	FR-4,PI,PP,Copper berth	Taiwan
12	doosan	FR-4,PP	South Korea
13	Tai Yao plate	FR-4,PP,Copper berth	Taiwan
14	Alight	FR-4,PP,Copper berth	Taiwan
15	Yaoguang	FR-4,PP,Copper berth	Taiwan
16	Yalong	FR-4,PP	The United States
17	ISOAL	FR-4,PP	Japan
18	OAK	Buried, buried resistance, PP	Japan
19	United States 3M	FR-4,PP	The United States
20	Bergs	Copper and aluminum matrix	Japan
21	The sun	ink	Taiwan
22	Murata	ink	Japan
23	generous andbenevolent	PI, covering membrane,Copper berth	China's jiangxi
24	Yasen	PPI, covering membrane	China jiangsu
25	Yong Sheng Tai	ink	China guangdong panyu
26	mita	ink	Japan
27	Transcript	ceramic material	Taiwan

28	HOME	ceramic material	Japan

29	Fe-Ni-Mn	Alloy Invar, Section Steel	Taiwan

PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED and other electronic products:

FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB,PCBA products work well before shipping. We'll test all of them according to your test procedure.

Product Tags:

hdi pcb design

multilayer circuit board

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